Thermoset resin modified polyimide resin composition
AssigneeChang Chun Plastics Co., Ltd.
InventorsKuen Yuan Hwang, An Pang Tu, Sheng Yen Wu
Life of this patent
Estimating the term…
Abstract
The present invention relates to a thermoset resin modified polyimide resin composition, which comprises (a) polyimide resin, (b) cyanate, (c)bismaleimide, and (d) nanometer filler. By using the present thermoset resin modified polyimide resin composition, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved and thus it is suitable for cladding with copper foil to produce printed circuit board.
Claims9
A thermoset resin modified polyimide resin composition, which comprises (a) polyimide resin, (b) cyanate, (c) bismaleimide, and (d) nanometer filler, wherein (a) polyimide resin is contained in an amount of from 0.1 to 10% by weight, (b) cyanate is contained in an amount of 0.1 to 10% by weight, (c) bismaleimide is contained in an amount of 0.1 to 10% by weight, and (d) nanometer filler is contained in an amount of 1 to 40% by weight, all based on the total weight of the composition.
Dependencies are inferred from the claim text.