Wafer grinding method
AssigneeDisco Corporation
InventorKazuma SEKIYA
Life of this patent
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Abstract
A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protective film forming step for forming a protective film by coating the front surface of the wafer with a liquid resin; a flattening step for scraping the front surface of the protective film formed on the front surface of the wafer to flatten the protective film; and a rear surface grinding step for placing the protective film side of the wafer on the holding surface of a chuck table for holding a wafer and grinding the rear surface of the wafer by a grinding means to a predetermined thickness.
Claims5
A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising:
- a protective film forming step for forming a protective film by coating the front surface of the wafer with a liquid resin;
- a flattening step for scraping the front surface of the protective film formed on the front surface of the wafer to flatten the protective film;
- and
- a rear surface grinding step for placing the protective film side of the wafer on the holding surface of a chuck table for holding a wafer and grinding the rear surface of the wafer by a grinding means to a predetermined thickness.
A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface, devices which are formed in a plurality of areas sectioned by the plurality of dividing lines and a plurality of electrodes which are formed on each of the devices, comprising:
- a protective film forming step for forming a protective film thick enough to cover the electrodes by coating the front surface of the wafer with a liquid resin;
- a flattening step for scraping the front surface of the protective film formed on the front surface of the wafer to form a flat surface from which the electrodes are not exposed;
- a rear surface grinding step for placing the protective film side of the wafer on the holding surface of a chuck table for holding a wafer and grinding the rear surface of the wafer by grinding means to a predetermined thickness;
- and
- an electrode exposing step for scraping the front surface of the protective film formed on the front surface of the wafer to expose the electrodes after the rear surface grinding step.
Dependencies are inferred from the claim text.