Connector applied underfill
OwnerScott D. Brandenburg, Charles I. Delheimerinventors
Life of this patent
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Abstract
Processes for reliably and durably mounting a connector body to a surface of a circuit board without using conventional underfill and overmolding techniques are provided. These processes involve preparation of a self-adhering connector subassembly comprising a connector body and an activatable solid adhesive disposed on a mounting surface of the connector body, positioning of the subassembly on a circuit board, and activation of the adhesive to securely attach the connector body to the circuit board.
Claims19
A process for securing a connector body to a circuit board, comprising:
- providing a preformed solid mass of adhesive material having a pre-defined pattern of openings corresponding with the pattern of solder balls on a mounting surface of a connector body;
- positioning the preformed solid mass of adhesive material on the mounting surface of the connector body with the openings of the preformed solid mass of adhesive material aligned with the solder balls so that the solder balls project into the openings, the connector body and adhesive material defining a subassembly;
- positioning the subassembly on a circuit board with the solder balls aligned with a pattern of contact pads on a circuit board, and with the preformed solid mass of adhesive material disposed between the circuit board and the mounting surface of the connector body;
- and
- activating the preformed solid mass of adhesive material to cause it to securely adhere the connector body to the circuit board.
A process for securing a connector body to a circuit board, comprising:
- providing a connector body having a pattern of solder balls on a mounting surface of the connector body;
- applying a liquid adhesive material to the mounting surface of the connector body in a pattern that surrounds the solder balls;
- partially curing the liquid adhesive material to form a subassembly in which the liquid adhesive is converted to a solid adhesive material;
- positioning the subassembly on a circuit board with the solder balls aligned with a pattern of contact pads on the circuit board and with the solid adhesive material disposed between the circuit board and the mounting surface of the connector body;
- and
- activating the preformed solid mass of adhesive material to cause it to securely adhere the connector body to the circuit board.
A self-adhering connector subassembly, comprising:
- a connector body having a mounting surface and a pattern of solder balls on the mounting surface;
- and
- an activatable solid adhesive disposed on the mounting surface of the connector body, the activatable solid adhesive having a pattern of openings in which the solder balls project.
Dependencies are inferred from the claim text.