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US 2008/0176390 A1Published application
Method of forming carbon-containing silicon nitride layer
AssigneeUnited Microelectronics Corp.
InventorPo-Lun Cheng
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Abstract
A method for forming a carbon-containing silicon nitride layer with superior uniformity by low pressure chemical vapor deposition (LPCVD) using disilane, ammonia and at least one carbon-source precursor as reactant gases is provided.
Claims16
A method for forming a gate, comprising:
- providing a substrate having a gate dielectric layer thereon;
- forming a conductive layer on the gate dielectric layer;
- patterning the conductive layer and the gate dielectric layer to form a gate electrode;
- forming offset spacers on the sidewalls of the gate electrode, the material of the offset spacers is carbon-containing silicon nitride;
- forming a material layer over the substrate and covering the gate electrode, wherein the material layer comprises a carbon-containing silicon nitride layer formed by low pressure chemical vapor deposition (LPCVD);
- and
- etching back the material layer to form spacers over sidewalls of the gate electrode.
4 more elements
Dependencies are inferred from the claim text.