Stress free package and laminate-based isolator package

A multi-tier ACF-based stress isolation method for a lead frame package comprising:

• (a) applying a multi-tier ACF film with a notch on a polyimide layer on lead frame die attach paddle;
• and
• (b) bonding a die to said applied multi-tier ACF film with said notch, said bonding done such that said notch is disposed between said die and said polyimide layer,
• said multi-tier ACF film providing stress isolation to said die via said notch.

A window frame ACF-based stress isolation method for a BGA or LGA package comprising:

• (a) applying an ACF layer on a BGA or LGA substrate;
• and
• (b) bonding a die to said applied ACF layer,
• said ACF layer providing stress isolation to said die by forming a gap in between said die and said BGA or LGA substrate.

A window frame ACF-based stress isolation method for a BGA or LGA package comprising:

• (a) applying an multi-tier ACF film with a notch on a BGA or LGA substrate;
• and
• (b) bonding a die to said applied ACF layer, said bonding done such that said notch is disposed between said die and said BGA or LGA substrate,
• said mutli-tier ACF film providing stress isolation to said die via said notch.

A window-frame ACF-based isolation method for magnetic coupling in a lead frame package comprising:

• (a) applying an ACF layer on a polyimide layer on lead frame die attach paddle, said ACF layer having a first metal trace;
• and
• (b) bonding a die to said applied ACF layer, said die having a second metal trace,
• said ACF layer isolating said first and second metal traces, said isolated first and second metal traces providing magnetic coupling.

A window-frame ACF-based isolation method for magnetic coupling in a BGA or LGA package comprising:

• (a) applying an ACF layer on a BGA or LGA substrate, said ACF layer having a first metal trace;
• and
• (b) bonding a die to said applied ACF layer, said die having a second metal trace,
• said ACF layer isolating said first and second metal traces, said isolated first and second metal traces providing magnetic coupling.

A method to reduce stress in a semiconductor package comprising:

• (a) selecting a stress sensitive area on a semiconductor die;
• (b) depositing a perimeter around said stress sensitive area on the semiconductor die;
• and
• (c) forming an air gap by contacting said semiconductor die having said deposited perimeter with a lead frame,
• wherein the formed air gap prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.

A method to reduce stress in a semiconductor package comprising:

• (a) selecting a stress sensitive area on a semiconductor die;
• (b) depositing a perimeter on a lead frame;
• and
• (c) contacting said lead frame having said perimeter with said semiconductor die,
• wherein said perimeter forms an air gap and prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.

A method teaching to produce a laminate that aids in reducing package stress comprising:

• identifying known dimensions associated with a specific semiconductor die;
• and
• depositing a perimeter on a laminate,
• wherein said perimeter is dimensioned such that an air gap is formed when the specific semiconductor die of know dimensions is placed on top of said laminate.

A method to form a stress free package comprising the steps of:

• depositing a first perimeter on a laminate;
• depositing a second perimeter on a semiconductor die;
• and
• forming an air gap by placing said semiconductor die with said second perimeter on said laminate with said first perimeter,
• wherein the formed air gap prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.

A method to reduce stress in a semiconductor package comprising:

• (a) depositing an anisotropic conducting film (ACF) on a semiconductor die, said ACF film further containing gold stud bumps;
• and
• (b) forming an air gap by contacting said semiconductor die having said deposited ACF film with gold stud bumps with a lead frame,
• wherein the formed air gap prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.

A method to reduce stress in a semiconductor package comprising:

• (a) depositing a continuous anisotropic conducting film (ACF) on a semiconductor die, said ACF film further having a plurality of gold stud bumps dispersed within;
• and
• (b) contacting said semiconductor die having said deposited ACF film with gold stud bumps with a lead frame,
• wherein said ACF film with gold stud bumps prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.

A method to reduce stress in a semiconductor package comprising:

• (a) depositing a notched anisotropic conducting film (ACF) on a semiconductor die, said ACF film further containing gold stud bumps;
• and
• (b) forming an air gap by contacting said semiconductor die having said notched ACF film with gold stud bumps with a lead frame,
• wherein the formed air gap prevents underfill or molding compound from coming in contact with said stress sensitive area on the semiconductor die.