Manufacturing method of electronic device
AssigneeFujitsu Limited
InventorHiroshi Kobayashi
Life of this patent
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Abstract
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting a circuit chip on the base through the thermosetting adhesive; holding the base while pressing a circuit chip side of the base and a film side of the base by a heating apparatus that heats the thermosetting adhesive; giving a tension to the base on which the circuit chip is mounted; and heating the thermosetting adhesive by the heating apparatus to cure the thermosetting adhesive, thereby fixing the circuit chip to the conductive pattern.
Claims4
A manufacturing method of manufacturing an electronic device, comprising the steps of:
- applying a thermosetting adhesive on a surface of a base that is formed such that a conductive pattern is formed on a film made of a resin, the surface of the base being a side of the base on which side the conductive pattern is formed;
- mounting a circuit chip to be connected to the conductive pattern, on the base through the thermosetting adhesive;
- holding the base while pinching a circuit chip side of the base and a film side of the base by a heating apparatus that heats the thermosetting adhesive, the heating apparatus including a pressing section that presses the base by abutting on the circuit chip side of the base and a supporting section that supports the base by abutting on the film side of the base;
- giving a tension to the base on which the circuit chip is mounted, in a direction in which the film spreads;
- and
- heating the thermosetting adhesive by the heating apparatus to cure the thermosetting adhesive, thereby fixing the circuit chip to the conductive pattern.
Dependencies are inferred from the claim text.