Fabrication method of multichip stacking structure

A fabrication method of a multichip stacking structure, comprising:

• preparing a chip carrier and a plurality of first and second chips, wherein each chip has a bond pad disposed at an edge of a surface thereof;
• stacking the first chips on the chip carrier to form a first chip module, wherein the first chips are stacked in a step-like manner in a first direction away from the bond pads of the first chips to expose the bond pads of the first chips;
• electrically connecting the bond pads of the first chips to the chip carrier by a plurality of first bonding wires;
• stacking the second chips on the first chip module to form a second chip module, wherein the second chips are stacked in the step-like manner to expose the bond pads of the second chips, a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive film with the bottom chip deviated from the top chip horizontally in a second direction toward the first bonding wires of the first chips, and the portion of the first bonding wire of the top chip is covered by the adhesive film;
• and
• electrically connecting the bond pads of the second chips to the chip carrier by a plurality of second bonding wires.

A fabrication method of a multichip stacking structure, comprising:

• preparing a chip carrier and a plurality of first chips;
• stacking the first chips on the chip carrier in a step-like manner to form a first chip module;
• electrically connecting the first chips to the chip carrier by a plurality of first bonding wires;
• stacking at least a second chip on the first chip module by an adhesive layer to form a second chip module, wherein the adhesive layer has a plurality of fillers disposed therein for supporting the second chip module;
• and
• electrically connecting the second chips to the chip carrier by a plurality of second bonding wires.

A fabrication method of a multichip stacking structure, comprising:

• preparing a chip carrier and a plurality of first chips;
• stacking the first chips on the chip carrier in a step-like manner to form a first chip module;
• electrically connecting the first chips to the chip carrier by a plurality of first bonding wires;
• stacking at least a second chip on the first chip module by an adhesive film to form a second chip module, wherein a portion of first bonding wires between the second chip module and a top chip of the first chip module is covered by the adhesive film;
• and
• electrically connecting the second chips to the chip carrier by a plurality of second bonding wires.