Method for manufacturing pixel structure

A method for manufacturing a pixel structure, comprising:

• providing a substrate having an active device formed thereon;
• forming a dielectric layer on the substrate to cover the active device;
• forming a first photoresist layer on the dielectric layer, wherein the first photoresist layer is in various thicknesses and has an opening located over the active device;
• performing an etching process with use of the first photoresist layer as a mask, so as to form a contact hole in the dielectric layer via the opening;
• reducing the thickness of the first photoresist layer so as to remove a portion of the first photoresist layer and expose a portion of the dielectric layer;
• forming a transparent conductive layer to cover the portion of the dielectric layer and the remained first photoresist layer, wherein the transparent conductive layer is electrically connected to the active device via the contact hole;
• removing the transparent conductive layer on the remained first photoresist layer, such that the transparent conductive layer disposed on the portion of the dielectric layer forms a pixel electrode;
• and
• removing the remained first photoresist layer.