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US 2008/0176167 A1Published application
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
AssigneeHitachi Chemical Company, Ltd.
InventorsTakashi Kawamori, Takashi Masuko, Shigeki Katogi, Masaaki Yasuda
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Abstract
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
Claims44
A photosensitive adhesive composition comprising:
- (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH;
- (B) a photo-polymerizable compound;
- and
- (C) a photopolymerization initiator.
1 more element
A photosensitive adhesive composition comprising:
- (A) a polymer soluble to an alkaline aqueous solution,
- (B) a photo-polymerizable compound;
- and
- (C) a photopolymerization initiator,
- wherein an adhesive pattern is formed by forming an adhesive layer consisted of the photosensitive adhesive composition on an adherend, light-exposing the adhesive layer via a photomask, and developing the adhesive layer with an alkaline aqueous solution after exposure, and
- another adherend can be bonded to the adherend via the adhesive pattern.
3 more elements
Dependencies are inferred from the claim text.