Enamel Varnish Composition For Enamel Wire And Enamel Wire Using The Same

An enamel wire having a conducting wire;

• and a plurality of insulated coating layers formed in the outside of the conducting wire, wherein the enamel wire comprises an adhesive coating layer formed of mixed resin comprising, as the innermost insulated coating layer directly connected to an outer surface of the conducting wire:
• a first polyamideimide resin, presented in following Chemistry FIG. 1;
• and a second polyamideimide resin, the second polyamideimide resin resulting from introducing a triazine ring having an imidazole group in a side chain into a major chain:
• In the Chemistry FIG. 1, ratio of m:n ranges from 0.1:0.9 to 0.9:0.1,
• R1 and R2 each is independently selected from the group consisting of alkyl group, alkoxy group and halogen, the alkyl group and the alkoxy group having 1 to 4 carbon atoms, a and b each is an integer of 0 to 4,
• R3 and R5 each is independently a residue derived from at least one acid compound selected from the group consisting of trimelitic acid, trimelitic di-anhydride, trimelityl chloride or derivatives of the trimelitic acid, and
• R4 is a residue derived from at least one aromatic diisocyanate compound selected from the group consisting of diphenylmethane-4,4′-diisocyanate, diphenylmethane-3,3′-diisocyanate, diphenylmethane-3,4′-diisocyanate, diphenylether-4,4′-diisocyanate, benzophenone-4,4′-diisocyanate, diphenylsulfone-4,4′-diisocyanate, tolylene-2,4-diisocyanate, tolylene-2,6-diisocyanate, m-xylene diisocyanate and p-xylenediisocyanate.