Method and Apparatus Providing a Structure Relative To A Support
AssigneeInternational Business Machines Corporation
InventorsPeter A. Gruber, Philip Charles Danby Hobbs
Life of this patent
Estimating the term…
Abstract
A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.
Claims19
A method to position an object, comprising
- applying a plurality of fusible elements between the object and a supporting base;
- and
- moving the object relative to the supporting base to achieve a predetermined displacement between the object and the supporting base, wherein moving the object relative to the supporting base comprises heating the plurality of fusible elements, and wherein the predetermined displacement is achieved through at least partial melting of at least a portion of the fusible elements.
An apparatus comprising:
- an applicator for dispensing fusible elements on at least a portion of a substrate;
- a placement mechanism for disposing a component onto the fusible elements on the substrate;
- and
- a heat source for selectively melting the fusible elements in a controlled manner, thereby changing a displacement of the component relative to the substrate, wherein the displacement is adjustable according to an extent different ones of the fusible elements are melted differently.
A structure, comprising:
- a substrate;
- and
- a component bonded to a surface of said substrate with a plurality of solder balls comprised of at least two types of non-eutectic solder materials, each non-eutectic solder material having a liquidus transition temperature that is distinct from its solidus temperature, wherein the liquidus transition temperature of one type of the non-eutectic solder material is distinct from the liquidus transition temperature of another type of non-eutectic solder material, wherein a surface of said component is aligned in a graduated manner relative to a surface of the substrate as a function of an extent of the melting of the solder balls during a bonding process.
A method, using a eutectic solder alloy array, of connecting an electronic component to a supporting base, comprising
- measuring a target offset between the component and the supporting base;
- selecting an appropriate decal containing fusible elements from a plurality of decals having different widths, heights and/or shape fusible elements based upon the measured target offset;
- locating the selected decal at the supporting base and applying the fusible elements to the supporting base by heating the fusible elements;
- removing a decal carrier of the decal from the fusible elements;
- and
- attaching the component to the supporting base by reheating the fusible elements.
A method, using a eutectic solder alloy array, of connecting an electronic component to a supporting base, comprising:
- attaching the component to a supporting base through fusible elements by holding the component with a Z stop fixture;
- heating the fusible elements to achieve a positive or negative displacement;
- and
- stopping Z displacement of the component relative to the supporting base when a desired target offset is reached by holding the component with the Z stop fixture in place while cooling the fusible elements to lock in the target offset.
Dependencies are inferred from the claim text.