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US 2008/0176046 A1Published application
Microstructure, micromachine, and manufacturing method of microstructure and micromachine
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsMayumi Yamaguchi, Konami Izumi
Life of this patent
Estimating the term…
Abstract
Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101, and a layer 103 to be a movable electrode is formed over the separation layer 102. At an interface of the separation layer 102, the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105. The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.
Claims19
A manufacturing method of a microstructure, comprising the steps of:
- forming a separation layer over a first support substrate;
- forming a first layer over the separation layer;
- exposing a part of the separation layer;
- attaching a second support substrate to the first layer with an adhesive layer interposed therebetween;
- separating the first support substrate from the first layer so that the first remains on the second support substrate;
- forming a spacer layer over a first protective substrate;
- attaching the first layer and the first protective substrate so as to face each other with the spacer layer interposed therebetween;
- and
- separating the first layer from the second support substrate.
6 more elements
A manufacturing method of a microstructure, comprising the steps of:
- forming a separation layer over a first support substrate;
- forming a first layer over the separation layer;
- exposing a part of the separation layer;
- attaching a second support substrate to the first layer with an adhesive layer interposed therebetween;
- separating the first support substrate from the first layer so that the first remains on the second support substrate;
- forming a first spacer layer over a first protective substrate;
- forming a second spacer layer over a second protective substrate;
- attaching the first layer and the first protective substrate so as to face each other with the first spacer layer interposed therebetween;
- separating the first layer from the second support substrate;
- and
- attaching the first layer and the second protective substrate so as to face each other with the second spacer layer interposed therebetween.
8 more elements
A manufacturing method of a micromachine, comprising the steps of:
- forming a separation layer over a first support substrate;
- forming a first layer over the separation layer;
- exposing a part of the separation layer;
- attaching a second support substrate to the first layer with an adhesive layer interposed therebetween;
- separating the first support substrate from the first layer so that the first remains on the second support substrate;
- forming a layer including a semiconductor element over a first protective substrate;
- forming a spacer layer over the layer including the semiconductor element;
- attaching the first layer and the first protective substrate so as to face each other with the spacer layer interposed therebetween;
- and
- separating the first layer from the second support substrate.
7 more elements
A manufacturing method of a microstructure, comprising the steps of:
- forming a separation layer over a first support substrate;
- forming a first layer over the separation layer;
- exposing a part of the separation layer;
- attaching a second support substrate to the first layer with an adhesive layer interposed therebetween;
- separating the first layer from the first support substrate from the first layer so that the first remains on the second support substrate;
- forming a first spacer layer over a layer including a semiconductor element;
- forming a second spacer layer over a second protective substrate;
- attaching the first layer and the first protective substrate so as to face each other with the first spacer layer interposed therebetween;
- separating the first layer from the second support substrate;
- and
- attaching the first layer and the second protective substrate so as to face each other with the second spacer layer interposed therebetween.
8 more elements
A microstructure comprising:
- a first spacer layer which is selectively formed over a first protective substrate, and a first layer which is formed over the first spacer layer, wherein
- the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically, and
- a space is provided between the movable portion of the first layer and the first protective substrate.
A microstructure comprising a first spacer layer which is selectively formed over a first protective substrate, a first layer formed over the first spacer layer, a second spacer layer which is selectively formed over the first layer, and a second protective substrate formed over the second spacer layer, wherein
- the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and
- the movable portion is displaced in a direction perpendicular to the first protective substrate or a direction parallel to the first protective substrate.
A micromachine comprising:
- an electric circuit formed over a first protective substrate;
- and
- a microstructure which is electrically connected to the electric circuit, wherein
- the electric circuit includes a first spacer layer which is selectively formed over the first protective substrate and a first layer formed over the first spacer layer,
- the first layer includes a fixed portion provided over the first spacer layer and a movable portion below which the first spacer layer is not provided, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the first layer and the first protective substrate, and
- the movable portion is displaced in a direction perpendicular to the first protective substrate.
4 more elements
A micromachine comprising:
- an electric circuit formed over a first protective substrate;
- and
- a microstructure which is electrically connected to the electric circuit, wherein
- the electric circuit includes a semiconductor element,
- the microstructure includes a first spacer layer which is selectively formed over the first protective substrate, a first layer formed over the first spacer layer, a second spacer layer which is selectively formed over the first layer, and a second protective substrate formed over the second spacer layer,
- the first layer includes a fixed portion formed over the first spacer layer and a movable portion below which the first spacer layer is not formed, and the fixed portion and the movable portion are at least partially connected physically,
- a space is provided between the movable portion of the first layer and the first protective substrate and between the movable portion and the second protective substrate, and
- the movable portion is displaced in a direction perpendicular to the first protective substrate.
5 more elements
Dependencies are inferred from the claim text.