Substrate treatment method, coating treatment apparatus, and substrate treatment system
AssigneeTokyo Electron Limited
InventorsKenji TSUTSUMI, Junichi Kitano, Osamu Miyahara, Hideharu Kyouda
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AssigneeTokyo Electron Limited
InventorsKenji TSUTSUMI, Junichi Kitano, Osamu Miyahara, Hideharu Kyouda
Estimating the term…
In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.
A substrate treatment method of performing at least photolithography processing and etching treatment for a substrate in this order a plurality of times, comprising the step of:
A coating treatment apparatus for forming a coating film on a rear surface of a substrate, comprising:
A substrate treatment system including a coating treatment apparatus for forming a coating film on a rear surface of a substrate and an exposure processing apparatus for performing exposure processing on the substrate,
Dependencies are inferred from the claim text.