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AssigneeTokyo Electron Limited
InventorsKenji TSUTSUMI, Junichi Kitano, Osamu Miyahara, Hideharu Kyouda
Estimating the term…
According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrate immediately after the exposure processing. Thereafter, etching treatment and so on are performed, and a series of these treatment and processing steps are performed a predetermined number of times. The coating film has been formed on the rear surface of the substrate at the time for the etching treatment, so that even if the coating film gets minute scratches, the rear surface of the substrate itself is protected by the coating film and thus never scratched. Further, since the coating film on the rear surface of the substrate is removed immediately before the exposure processing, the rear surface of the substrate can be flat for the exposure processing.
A substrate treatment method of performing at least photolithography processing and etching treatment for a substrate in this order a plurality of times, comprising the steps of:
A coating film removing apparatus for removing a coating film formed on a rear surface of a substrate, comprising:
A substrate treatment system including a coating film removing apparatus for removing a coating film formed on a rear surface of a substrate and an exposure processing apparatus for performing exposure processing on the substrate,
Dependencies are inferred from the claim text.