Injection molding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsHan Sub HWANG, Sung Ki Min, Sang Hun Lee, Jong Won Lee
Life of this patent
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Abstract
An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
Claims7
An injection molding apparatus comprising:
- first and second molds which mate with each other to define a molding cavity;
- a stationary member which supports the first mold;
- a movable member which supports the second mold and moves backwards and forwards together with the second mold;
- and
- a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
Dependencies are inferred from the claim text.