Techniques for forming interconnects
AssigneeInternational Business Machines Corporation
InventorsDavid H. Danovitch, Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih
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Abstract
A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.
Claims25
An apparatus for forming interconnects onto attachment points of a wafer, comprising:
- a mold with a plurality of cavities having a predetermined shape;
- a release agent disposed on surfaces of said cavities;
- said cavities being filled with an interconnect material to form said interconnects;
- a source of energy to cause said release agent to be removed from said mold;
- and
- a holder for holding said mold adjacent said wafer for attaching said interconnects to said attachment points of said wafer.
In combination:
- a wafer having a plurality of attachment points;
- and
- an apparatus for forming interconnects onto said attachment points of said wafer, said apparatus in turn comprising:
- a mold with a plurality of cavities having a predetermined shape;
- a release agent disposed on surfaces of said cavities;
- said cavities being filled with an interconnect material to form said interconnects;
- and
- a source of energy to cause said release agent to be removed from said mold, said mold being adjacent said wafer for attaching said interconnects to said attachment points of said wafer.
Dependencies are inferred from the claim text.