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US 2008/0175748 A1Published application
Solder Composition
OwnerJohn Pereirainventor
Life of this patent
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Abstract
A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.
Claims28
A solder composition having a mixture of elements comprising tin, indium silver and bismuth, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth.
A method of forming a solder composition comprising mixing tin, indium silver and bismuth together, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth.
Dependencies are inferred from the claim text.