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US 2008/0175746 A1Published application
Cu-Ni-Si system copper alloy for electronic materials
AssigneeNippon Mining & Metals Co., Ltd.
InventorsNaohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
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Abstract
The present invention provides Corson alloy having remarkably improved properties, in particular, by bringing out the effect of added Cr more efficiently. A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni; 0.50-1.2% by mass of Si; 0.0030-0.2% by mass of Cr; balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less is provided.
Claims5
A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni;
- 0.50-1.2% by mass of Si;
- 0.0030-0.2% by mass of Cr;
- balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less.
Dependencies are inferred from the claim text.