US 2008/0175304 A1Published application

Thermocouple circuit and method and system for forming same

AssigneeCorning Incorporated

InventorsLee Martin Adelsberg, John Michael Drosdak, Paul Richard Grzesik, Trudy A. Knutson, David Myron Lineman, Kevin Barry Reiman

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Abstract

Disclosed is a thermocouple circuit that exhibits reduced levels of thermocouple drift. The thermocouple is generally comprised of first and second thermoelectric elements formed of first and second thermoelectric materials, respectively. The first and second thermoelectric elements are coupled to an electrically conductive substrate through intermediate first and second tab elements, respectively. The first and second tab elements are preferably formed of the respective first and second thermoelectric materials, and coupled to the substrate in a spaced apart configuration such that the first and second tab elements, are not physically coupled one to the other. Also disclosed are systems and methods for the preparation and use of the thermocouple circuits disclosed herein.

Claims16

Dependent claims

A method for determining a temperature of a portion of an electrically conductive substrate, comprising:

providing a thermocouple comprising a first thermoelectric element formed of a first thermoelectric material and having a first proximal end and a first distal end, and a second thermoelectric element formed of a second thermoelectric material and having a second proximal end and a second distal end;
forming a thermocouple circuit by coupling the respective proximal ends of the first and second thermoelectric elements to a portion of the substrate through intermediate first and second tab elements, respectively, the first and second tab elements having a composition substantially the same as the first and second thermoelectric materials, respectively, and wherein the first and second tab elements are spaced apart such that the first and second proximal ends are not physically coupled each to the other;
and
quantifying a voltage provided by the formed thermocouple circuit, wherein said voltage is indicative of a temperature within the portion of the substrate.

1 more element

Dependencies are inferred from the claim text.