US 2008/0175298 A1 · Surface Mount Testing System

Abstract

Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

Claims15

Dependent claims

A method for inducing degradation of solder joints and components on a surface mount printed wiring board coupon including alternating layers of dielectric material and conductive material stacked one upon another, and at least one heating trace mounted on a surface of the surface mount printed wiring board coupon or between layers of dielectric material, the method comprising:

determining a first value indicative of a temperature of at least one heating trace on the surface mount printed wiring board or between the layers of dielectric material based on a measured electrical resistance of the at least one heating trace;
determining a difference between the first value and a second value indicative of a desired temperature of the at least one heating trace on the surface mount printed wiring board or between the layers of dielectric material;
and
applying a particular current and a particular voltage to the at least one heating trace mounted on the surface mount printed wiring board coupon or between the layers of dielectric material based on the determined difference between the first value and the second value.

1 more element

An apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board coupon including alternating layers of dielectric material and conductive material stacked one upon another, and at least one heating trace mounted on a surface of the surface mount printed wiring board coupon or between layers of dielectric material, the apparatus comprising:

a housing surrounding an area for mounting the at least one surface mount printed wiring board coupon;
at least one cooling component for cooling the surface mount printed wiring board coupon;
and
a controller module electrically connected to each of the at least one cooling component, the controller module being arranged to be electrically connected to a portion of the surface mount printed wiring board coupon, the controller module being configured to receive information indicative of target temperature from a processing device, to monitor a value indicative of a temperature of the at least one heating trace, to apply an electrical current to the at least one heating trace when the monitored value and the received information indicate that the at least one heating trace has a temperature lower than the target temperature.

1 more element

Dependencies are inferred from the claim text.

Surface Mount Testing System

Life of this patent

Surface Mount Testing System

Life of this patent

Abstract

Claims15