Semiconductor device and method for fabricating the same
AssigneeEudyna Devices Inc.
InventorsHirotada Satoyoshi, Satoshi Kajiyama, Syu Goto, Hiroyuki Sumitomo, Shigekazu Izumi
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Abstract
A method for fabricating a semiconductor device includes dividing an off substrate so that a first edge face, the off substrate having an operation layer on a main surface of the off substrate, and cutting the off substrate to form a second edge face crossing the first edge face so that an entire surface of the second edge face is closer to a direction vertical to the main surface of the off substrate than a surface cleaved along with the second edge face.
Claims15
A method for fabricating a semiconductor device comprising:
- dividing an off substrate so that a first edge face, the off substrate having an operation layer on a main surface of the off substrate;
- and
- cutting the off substrate to form a second edge face crossing the first edge face so that an entire surface of the second edge face is closer to a direction vertical to the main surface of the off substrate than a surface cleaved along with the second edge face.
A method for fabricating a device comprising:
- providing a semiconductor device having an operation layer provided on an off substrate, a first edge face that is a cleavage plane and a second edge face crossing the first edge face, an entire surface of the second edge face being closer to a direction vertical to the main surface of the off substrate than a surface cleaved along with the second edge face;
- aligning the second edge face of the semiconductor device and a positioning portion of a mount portion;
- and
- subsequently securing the semiconductor device on the mount portion.
A semiconductor device comprising:
- an off substrate;
- an operation layer formed on a main surface the off substrate;
- a first edge face that is a cleavage plane of the off substrate;
- and
- a second edge face crossing the first edge face and an entire surface of the second edge face is closer to a direction vertical to the main surface of the off substrate than a surface cleaved along with the second edge face.
A device comprising:
- a semiconductor device having an operation layer provided on an off substrate, a first edge face that is a cleavage plane and a second edge face crossing the first edge face, an entire face of the second edge face being closer to a direction vertical to the main surface of the off substrate than a surface cleaved along with the second edge face;
- and
- a mounting portion for securing the semiconductor device, the second edge face of the semiconductor device is aligned with a positioning portion of a mount portion.
Dependencies are inferred from the claim text.