US 2008/0174978 A1 · Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Abstract

It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two wiring boards 10 and 20. An electrode 34 of the electronic component 30 is electrically connected to at least one of the wiring boards. Also, the wiring boards 10 and 20 are electrically connected to each other. Additionally, the gap between the wiring boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a bonding pad 12 formed on one of the wiring boards 10 and 20 is electrically connected to an electrode 32 of the electronic component 30 by a bonding wire 60, and that at least a connection portion between the electrode 32 of the electronic component 30 and the bonding wire 60 is coated with a protection material 70.

Claims6

Dependent claims

An electronic component built-in substrate comprising:

at least two wiring boards,
an electronic component provided between the two wiring boards, and
an electrode of the electronic component,
the electrode being electrically connected to at least one of the wiring boards, the wiring boards being electrically connected to each other, and a gap between the wiring boards being sealed with a resin, wherein
a bonding pad formed on one of the wiring boards is electrically connected to an electrode of the electronic component by a bonding wire, and
at least a connection portion between the electrode of the electronic component and the bonding wire is coated with a protection material.

3 more elements

Dependencies are inferred from the claim text.

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Life of this patent

Electronic component built-in substrate and method of manufacturing electronic component built-in substrate

Life of this patent

Abstract

Claims6