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US 2008/0174977 A1Published application
Electronic component contained substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorAkinobu INOUE
Life of this patent
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Abstract
An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.
Claims8
An electronic component contained substrate comprising:
- a pair of wiring substrates;
- an electronic component which is mounted between the pair of wiring substrates;
- a solder ball which electrically connects the pair of wiring substrates;
- and
- a sealing resin which seals a space between the pair of wiring substrates,
- wherein the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, has an opening portion, which is larger than a planar shape of the electronic component, in a position that opposes the electronic component.
3 more elements
Dependencies are inferred from the claim text.