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US 2008/0174975 A1Published application
Flexible wiring substrate and method for producing the same
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorHiroaki KURIHARA
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Abstract
Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.
Claims6
A flexible wiring substrate comprising
- an insulating substrate,
- a wiring pattern formed on a surface of the insulating substrate, and
- a solder resist layer formed on a surface of the wiring pattern,
- wherein the solder resist layer is formed on a part of the surface of the wiring pattern to leave at least terminal portions of the wiring pattern uncovered by the solder resist layer,
- wherein the wiring pattern is a multilayer comprising a base layer formed of a conductor and a first tin plating layer, and
- wherein the uncovered terminal portions of the wiring pattern have a tin-bismuth alloy plating layer which is formed on the surface of the first tin plating layer of the wiring pattern.
3 more elements
Dependencies are inferred from the claim text.