Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
AssigneeFujitsu Limited
InventorsYoshiro Tanaka, Toshiyuki Homma, Hideaki Kamikakoi
Life of this patent
Estimating the term…
Abstract
A printed circuit board assembly is configured and arranged so that memory modules are mounted thereto. At least two connectors are mounted on a printed circuit board. The connectors are configured so that the memory modules are connected thereto. An electromagnetic wave absorption sheet is provided to at least one of the connectors. The electromagnetic wave absorption sheet is attached so as to cover a side surface of the one connector facing a side surface of the other connector.
Claims12
A printed circuit board assembly configured and arranged so that memory modules are mounted thereto, the printed circuit board assembly comprising:
- a printed circuit board;
- at least two connectors mounted on the printed circuit board, the connectors being configured so that the memory modules are connected thereto;
- an electromagnetic wave absorption sheet provided to at least one of the connectors,
- wherein the electromagnetic wave absorption sheet is attached so as to cover a side surface of said one connector facing a side surface of the other connector.
An enclosure of information technology equipment configured so that a printed circuit assembly is incorporated therein, the printed circuit assembly being configured so that memory modules are mounted opposite and parallel to each other, the enclosure of information technology equipment comprising:
- an opening part provided on an enclosure wall at a position opposite to said memory modules;
- a memory module cover for closing the opening part;
- and
- a metal plate provided to cover an inner surface of said enclosure wall on which said opening part is provided, the metal plate being at a ground potential,
- wherein a conductive material is provided on an inner surface of said memory module cover, and a portion of said metal plate is formed as a protruding part so that the protruding part is in contact with the conductive material in a vicinity of said opening part.
Dependencies are inferred from the claim text.