Electronic device with flip module having low height
AssigneeSony Ericsson Mobile Communications AB
InventorsHakan Bygdo, Per Holmberg
Life of this patent
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Abstract
An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
Claims16
An electronic devices, comprising:
- a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface;
- a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surfaces of the main PCB, and the at least one electrical component extends into the hole;
- and
- a cover on the bottom surface of the main PCB that substantially covers the hole.
An electronic device, comprising:
- a main printed circuit board (PCB) having a top surface, a bottom surface, and a cavity formed in the top surface extending toward the bottom surface;
- a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the cavity.
Dependencies are inferred from the claim text.