Printed Board Assembly With Improved Heat Dissipation
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorJohan Sandwall
Life of this patent
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Abstract
A multi-layer printed board assembly (PBA) with improved heat dissipation characteristics. An electronic component is surface mounted on a main surface at least partially over a cooling component arranged integrally in the PBA. The cooling component transports heat from the electronic component through the PBA in a first direction (x) essentially perpendicular to the main surface of the PBA, and in a second direction (y) essentially parallel to the main surface of the PBA.
Claims9
1-8. (canceled)
A printed board assembly (PBA), comprising:
- a first supporting layer of a non-conducting material;
- a first layer of a conducting material;
- a first electronics component surface mounted on the PBA;
- and
- a first cooling component arranged integrally in the PBA for transporting heat from the first electronics component;
- wherein:
- the first electronics component is mounted at least partially over the first cooling component;
- and
- the first cooling component is arranged in the PBA so that it transports heat generated by the first electronics component in a first direction (x) which is essentially perpendicular to a first main surface of the PBA and in a second main direction (y) which is essentially parallel to the first main surface of the PBA.
A method of manufacturing a printed board assembly (PBA), comprising the steps of:
- preparing an opening in a first layer of a non-conducting laminate for receiving a first cooling component;
- preparing the first cooling component for being fitted into the opening in the laminate;
- fitting the cooling component into the laminate;
- preparing circuit patterns on at least a first main side of the laminate;
- processing the first laminate layer and the first cooling component so that they together become a PBA;
- preparing and fitting the first cooling component into the laminate in such a way that it can transport heat in a first direction (x) which is essentially perpendicular to a first main surface of the PBA and in a second main direction (y) which is essentially parallel to said first main surface of the PBA;
- and
- surface mounting a first electronics component on the first main surface of the PBA, at least partially over the first cooling component.
Dependencies are inferred from the claim text.