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US 2008/0174957 A1Published application
Electronic device cooling system
OwnerJeffrey A. Levinventor
Life of this patent
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Abstract
An electronic device cooling system, comprising an electronic device comprising a plurality of housing walls and at least one duct wall extending between at least one of the housing walls and a circuit board disposed within the electronic device to form a duct to enable cooling air to flow within the duct to dissipate heat from within the electronic device.
Claims20
An electronic device cooling system, comprising
- an electronic device comprising a plurality of housing walls;
- and
- at least one duct wall extending between at least one of the housing walls and a circuit board disposed within the electronic device to form a duct to enable cooling air to flow within the duct to dissipate heat from within the electronic device.
A method of manufacturing an electronic device cooling system, comprising
- providing an electronic device comprising a plurality of housing walls;
- and
- providing at least one duct wall extending between at least one of the housing walls and a circuit board disposed in the electronic device to form a duct to enable cooling air to flow within the duct to dissipate heat from within the electronic device.
An electronic device cooling system, comprising:
- a means for housing a circuit board means, the housing means comprising a plurality of wall means;
- and
- at least one duct wall means extending between at least one of the housing wall means and the circuit board means to form a duct means to direct cooling air flow to dissipate heat from the housing means.
An electronic device cooling system, comprising
- a cooling air duct disposed within a housing of an electronic device, the cooling air duct formed by a first circuit board, a second circuit board and at least one duct wall extending between the first and second circuit boards.
Dependencies are inferred from the claim text.