Data storage device enclosures, a midplane, a method of manufacturing a midplane and modules
AssigneeXyratex Technology Limited
InventorDavid M. DAVIS
Life of this patent
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Abstract
A data storage device enclosure for housing one or more data storage devices is disclosed. The enclosure has housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module. Each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/an integer), w, h, WE and HE each being measured in the same plane. The first dimension of said electronics module is twice the first dimension of said power supply module.
Claims38
A data storage device enclosure for housing one or more data storage devices, the enclosure having housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/an integer), w, h, WE and HE each being measured in the same plane, wherein the first dimension of said electronics module is twice the first dimension of said power supply module.
A data storage device enclosure for housing one or more data storage devices, the enclosure having housed therein a plurality of modules, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers that may be different for each module, wherein w=(the width of the enclosure WE/an integer between 1 and 6 inclusive) and h=(the height of the enclosure HE/an integer), w, h, WE and HE each being measured in the same plane, wherein the power supply module is positioned adjacent the electronics module and is arranged to draw cooling air through the electronics module.
A midplane for a data storage device enclosure, the midplane comprising:
- a circuit board having a front surface and a rear surface;
- a plurality of connectors on the front surface for connecting to respective data storage devices;
- a first power supply module connector and a first electronics module connector on the rear surface, the first power supply module connector and the first electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane;
- and,
- a second power supply module connector and a second electronics module connector on the rear surface, the second power supply module connector and the second electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane;
- the position and orientation of the second power supply module connector being a 180 degree rotation of the position and orientation of the first power supply module connector about an axis perpendicular to the plane of the circuit board;
- and,
- the position and orientation of the second electronics module connector being a 180 degree rotation of the position and orientation of the first electronics module connector about an axis perpendicular to the plane of the circuit board;
- wherein said connectors on the rear surface do not overlap with any of the connectors on the front surface.
A method of manufacturing a midplane for a data storage device enclosure, the midplane comprising:
- a circuit board having a front surface and a rear surface;
- a plurality of connectors on the front surface for connecting to respective data storage devices;
- a first power supply module connector and a first electronics module connector on the rear surface, the first power supply module connector and the first electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane;
- and,
- a second power supply module connector and a second electronics module connector on the rear surface, the second power supply module connector and the second electronics module connector being generally elongate and having their long axes aligned in the direction of the width of the midplane;
- the position and orientation of the second power supply module connector being a 180 degree rotation of the position and orientation of the first power supply module connector about an axis perpendicular to the plane of the circuit board;
- and,
- the position and orientation of the second electronics module connector being a 180 degree rotation of the position and orientation of the first electronics module connector about an axis perpendicular to the plane of the circuit board;
- wherein said connectors on the rear surface do not overlap with any of the connectors on the front surface,
- the method comprising manufacturing the circuit board as a non-laminated piece.
A plurality of modules for being housed in a data storage device enclosure, at least one of the modules being a power supply module and at least one of the modules being an electronics module, wherein each module has a width of substantially n*w and a height of substantially m*h, where n and m are integers that may be different for each module, wherein w is between about 102.5 mm and about 109.5 mm and h is between about 36 mm and about 42 mm.
A plurality of data storage device enclosures, each enclosure comprising:
- at least one power supply bay for accepting a power supply module, each power supply bay of each enclosure having a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers, which may be different for the different power supply bays and for the different enclosures, such that power supply modules are interchangeable between said enclosures;
- and,
- at least one electronics module bay for accepting an electronics module, each electronics module bay of each enclosure having a first dimension of substantially n*w and a second dimension of substantially m*h, where n and m are integers, which may be different for the different electronics module bays and for the different enclosures, such that electronics modules are interchangeable between said enclosures,
- wherein w is between about 104.5 mm and about 110.5 mm and h is between about 38 mm and about 43 mm,
- wherein at least one of the number of bays or layout of bays is different for each enclosure.
Dependencies are inferred from the claim text.