Solid-state imaging device
AssigneeNEC Electronics Corporation
InventorHirochika Narita
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Abstract
The invention provides a solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element. The solid-state imaging device 10 of the present invention includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.
Claims5
A solid-state imaging device, comprising:
- an elongated substrate;
- a metallic layer exposed to a surface of said substrate and extending in an elongating direction of the substrate;
- and
- an elongated solid-state image sensing element mounted over said metallic layer,
- wherein a thickness in a region of said metallic layer right under an amplifier unit of said solid-state image sensing element is larger than thicknesses in other regions of said metallic layer.
Dependencies are inferred from the claim text.