Media preheater
AssigneeXerox Corporation
InventorsKelvin Kwong, Darrell Ray Finneman, Stephen Ray Ricketts, Samuel John Geser
Life of this patent
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Abstract
A heater for preheating media in an imaging device comprises a substantially planar polymeric carrier having an exterior surface. A channel is recessed into the exterior surface of the carrier. A resistance heating element is disposed in the channel, the resistance heating element having a first and second end for coupling to a power source. The heater includes an over molded polymeric layer disposed in the channel such that the resistance heating element is substantially encapsulated in the channel and such that an exterior surface of the over molded layer is substantially flush with the exterior surface of the carrier.
Claims20
A heater for preheating media in an imaging device, the heating element comprising:
- a polymeric carrier having an exterior surface;
- a resistance heating element disposed within an over mold at least partially covering the carrier, the resistance heating element having a first and second end for coupling to a power source;
- and
- the over molded polymeric layer disposed such that the resistance heating element is substantially encapsulated .
A method of manufacturing a heating element for use in an imaging device, the method comprising:
- placing a resistance heating wire on an exterior surface of a polymeric carrier;
- and
- over molding a polymer layer so that the resistance heating wire is substantially encapsulated by the over molding material.
A heater for preheating media in an imaging device, the heating element comprising:
- a polymeric carrier assembly, the carrier assembly including an exterior surface, a leading edge and a trailing edge;
- a pair of electrical contacts formed in the exterior surface of the carrier assembly for connecting to a power source;
- a series of heater element placement features on the exterior surface of the carrier, the placement features defining a circuitous path across a length and width of the carrier assembly;
- a resistance heating element disposed in the placement features, the resistance heating element having a first and second termination electrically coupled to the pair of electrical contacts;
- and
- an over molded polymeric layer disposed over the carrier assembly substantially encapsulating the resistance heating element.
Dependencies are inferred from the claim text.