Ink-jet print head and method for manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSung Joon PARK, Jeong Wuk HAN, Yong Shik PARK
Life of this patent
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Abstract
An ink-jet print head and a method for manufacturing the same. The ink-jet print head includes: an ink ejection part to eject ink; pad regions having connecting pads to apply an electric signal to the ink ejection part; and unitary partition walls disposed at outer edges of the pad regions. The partition walls prevent particles, which are generated when cutting apart adjacent print heats when manufacturing the ink-jet print head, from scattering onto the pad regions. The partition walls are formed together with a flow channel layer and a nozzle layer of the ink ejection part.
Claims16
An ink-jet print head comprising:
- a substrate having pad regions;
- an ink ejection part disposed on the substrate adjacent to the pad regions, to eject ink;
- connecting pads disposed in the pad regions, to apply an electric signal to the ink ejection part;
- and
- partition walls disposed along edges of the pad regions, to block particles generated when the edges of the substrate are cut, from entering the pad regions,
- wherein each of the partition walls includes an extending portion that extends along one side of the pad regions, and bent portions that extend from the extending portion.
An ink-jet print head comprising:
- a substrate having pad regions;
- an ink ejection part disposed on the substrate adjacent to the pad regions, comprising a flow channel layer and a nozzle layer disposed on the flow channel layer;
- plurality of connecting pads disposed in the pad regions, to control the ink ejection part;
- and
- partition walls disposed along three sides of the pad regions, adjacent to edges of the substrate.
The ink-print head according to 9, wherein the pad regions are surrounded by a combination of the flow channel layer, the nozzle layer, and the partition walls.
A method for manufacturing ink-jet print heads on a wafer, comprising:
- forming the ink ejection part and the connecting pads on head chip regions of a wafer, which are separated from one another by cutting regions;
- forming partition walls between the pad regions and the cutting regions, while forming the ink ejection part, to separate the pad regions from the cutting regions;
- attaching a protective member to cover the ink ejection part, the pad regions, and the partition walls;
- and
- cutting the wafer along the cutting regions, to separate the head chip regions from each other.
Dependencies are inferred from the claim text.