Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same

A method of testing a semiconductor package, the method comprising:

• i) providing a test socket having a socket body, a socket head disposed on the socket body for combination with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element;
• ii) inserting a semiconductor package into the socket body;
• iii) applying a first voltage to the power terminals to generate heat from the Peltier element, the heat from the Peltier element being conducted to the semiconductor package;
• iv) operating the semiconductor package;
• v) testing the semiconductor package;
• and
• vi) replacing the semiconductor package that has been tested with a new semiconductor package to be tested.

A test equipment comprising:

• a test unit having a test socket in which a semiconductor package is located;
• a temperature sensing unit connected to the test unit to indicate a temperature of the semiconductor package;
• and
• a control unit connected to the temperature sensing unit to control the test unit, wherein the test socket comprises:
• a socket body in which the semiconductor package is located;
• a socket head combined with the socket body;
• a Peltier element arranged in the socket head to be adjacent the semiconductor package;
• and
• power terminals connected to the Peltier element.