Back to results
US 2008/0174330 A1Published application
Rotational positioner and methods for semiconductor wafer test systems
AssigneeTeradyne, Inc.
InventorFrank Parrish
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeTeradyne, Inc.
InventorFrank Parrish
Estimating the term…
A semiconductor wafer prober is configured to rotate a semiconductor wafer into relative alignment with a wafer-interface probe adapted to simultaneously probe a number of integrated circuits within a sector of the semiconductor wafer. The wafer can include integrated circuits having different orientations, such that all of the integrated circuits within a given sector being tested have the same orientation. For example, a semiconductor wafer can include two semicircular sectors, with the integrated circuits on either sector having a common orientation rotated 180 degrees from a common orientation of the integrated circuits of the other sector. A wafer-interface probe, or probe card, adapted to test the entire semicircular sector during a single touch down is able to test the entire wafer with one rotational translation between testing.
A semiconductor tester adapted for testing a semiconductor wafer including a plurality of integrated circuits arranged in a lattice, the semiconductor tester comprising:
A method for testing integrated circuits of a semiconductor wafer including a plurality of integrated circuits, each integrated circuit having a respective bonding pad pattern providing electrical access thereto, the test comprising:
A semiconductor wafer comprising;
A wafer-interface probe comprising a plurality of contact patterns arranged in a non-rectangular, two-dimensional array, each contact pattern adapted to interface with a corresponding bonding pad pattern of a respective one of a plurality of integrated circuits of a semiconductor wafer.
Dependencies are inferred from the claim text.