Probing Structure With Fine Pitch Probes
AssigneeFormFactor, Inc.
InventorCharles A. Miller
Life of this patent
Estimating the term…
Abstract
A microelectronic resilient structure can comprise a support member and a platform attached to the support member. The platform can comprise a non-conductive, resilient beam that extends away from the support member, and a plurality of conductive members can be disposed on the beams. The conductive members can extend along a length of the beam. A plurality of conductive contact elements can be disposed on the beam and electrically connected to one of the conductive members.
Claims32
A microelectronic resilient structure comprising:
- a support member;
- a platform attached to the support member and comprising a non-conductive, resilient beam that extends away from the support member;
- a plurality of conductive members disposed on and extending along a length of the beam;
- and
- a plurality of conductive contact elements each disposed on the beam and electrically connected to one of the conductive members.
A probe card assembly comprising:
- a first substrate;
- a platform comprising a base and a plurality of cantilevered beams extending from the base, the platform being substantially electrically insulating;
- a plurality of support members mounted on the first substrate and attached to the base of the platform;
- a plurality of conductive test probes attached to and extending along a length of ones of the beams, each test probe comprising a conductive trace and a conductive contact element, wherein at least one of the beams has disposed thereon at least two of the probes;
- an electrical interface to a tester;
- and
- electrical connections between the electrical interface and the first substrate.
A method for testing a semiconductor device comprising:
- bringing probes of a contactor device into contact with terminals of the semiconductor device, the contactor device comprising a plurality of electrically non-conductive beams on which the probes are disposed, wherein at least two probes are disposed on at least one of the beams;
- providing test signals through ones of the probes to ones of terminals of the semiconductor device;
- and
- sensing response signals generated by the semiconductor device in response to the test signals at others of the probes in contact with others of the terminals of the semiconductor device.
The method of 24, wherein:
- the at least one of the beams twists about a first axis, providing compliance locally to each probe on the beam, and
- the at least one of the beams bends about a second axis different than the first axis, providing global compliance to the probes on the beam.
A method of making a contactor device, the method comprising:
- fabricating a structure comprising a plurality of probes configured to contact terminals of an electronic device to be tested, the structure comprising an electrically non-conductive platform comprising a base portion and a plurality of beams extending from the beam portion, the probes disposed on and extending along a length of ones of the beams, wherein at least two probes are disposed on at least one of the beams;
- and
- attaching the structure to a substrate comprising electrically conductive terminals.
Dependencies are inferred from the claim text.