Method and apparatus for inspecting process performance for use in a plasma processing apparatus
AssigneeTokyo Electron Limited
InventorYohei YAMAZAWA
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AssigneeTokyo Electron Limited
InventorYohei YAMAZAWA
Estimating the term…
A method inspects a process performance of a capacitively coupled plasma processing apparatus which generates a plasma for a plasma processing by applying a radio frequency power between a first electrode and a second electrode disposed in a processing vessel to face the first electrode in parallel. The method includes measuring an impedance of a radio frequency transmission path ranging from a rear surface of the first electrode to a ground potential part and sweeping a frequency to thereby obtain a frequency characteristic of a real resistance component of the impedance; reading a specific property value of a horn-like peak which appears from the frequency characteristic of the real resistance component; and determining efficaciousness or inferiority of the process performance of the plasma processing apparatus based on the peak property value.
A method for inspecting a process performance of a capacitively coupled plasma processing apparatus which generates a plasma for a plasma processing by applying a radio frequency wave between a first electrode attached to a depressurizable processing vessel and a second electrode disposed in the processing vessel to face the first electrode in parallel, the first electrode being ungrounded, the method comprising:
An apparatus for inspecting a process performance of a capacitively coupled plasma processing apparatus which generates a plasma for a plasma processing by applying a radio frequency wave between a first electrode attached to a depressurizable processing vessel and a second electrode disposed in the processing vessel to face the first electrode in parallel, the first electrode being ungrounded, the apparatus comprising:
Dependencies are inferred from the claim text.