High Power Lamp and LED Device Thereof

Abstract

A high-power LED lamp comprises a cuplike lamp housing, an LED device, an adapter and a circuit board. The inner surface of the cuplike lamp housing is a reflective curved surface for reflecting the light from the LED device disposed at the bottom the cuplike lamp housing, so as to improve the lighting efficiency. The position of the LED device has the relation: 0.05<HL/HT<0.35, where HT is the total depth of the cuplike lamp housing, HL is the distance between a surface of the LED device and the bottom of the cuplike lamp housing. The adapter is configured to secure the LED device, and the circuit board is configured to provide power source to the LED device. The LED device is a stack structure comprising an LED package device, a ring member, an electrode plate and an insulation glue layer. The LED package device comprises at least one LED die, the ring member is disposed below the LED package device, the electrode plate is disposed below the ring member and is provided with a rod at the center thereof. The rod penetrates through the ring member and is connected to a bottom of the LED package device. The insulation glue layer is disposed between the electrode plate and the ring member for insulation between positive and negative electrodes.

Dependencies are inferred from the claim text.