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US 2008/0174037 A1Published application
Patterning method
AssigneeMicro-Star Int'l Co., Ltd.
InventorYu-Ho Chen
Life of this patent
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Abstract
A patterning method is provided. A predetermined pattern is drawn on a substrate, and a plurality of decorative parts is distributed and fixed on the predetermined pattern through a bonding process. In addition, a pattern obtained by distributing the plurality of decorative parts assumes a three-dimensional pattern model on the substrate.
Claims18
A patterning method, comprising:
- selecting a substrate and a plurality of decorative parts;
- forming a plurality of mounting positions through a cartographic process, so as to draw a predetermined pattern;
- fixing the plurality of decorative parts on the mounting positions through a bonding process;
- and
- forming a three-dimensional pattern by the plurality of decorative parts on the substrate.
2 more elements
A patterning method, comprising:
- selecting a substrate and a plurality of decorative parts;
- forming a plurality of mounting positions on the substrate through a cartographic process, so as to draw a predetermined pattern;
- measuring coordinate data of the plurality of mounting positions through a measuring process;
- fixing the plurality of decorative parts at the mounting positions through a bonding process according to the coordinate data;
- and
- forming a three-dimensional pattern by the plurality of decorative parts on the substrate.
3 more elements
Dependencies are inferred from the claim text.