Multichip stacking structure

A multichip stacking structure, comprising

• a chip carrier;
• a first chip module having a plurality of first chips, wherein each of the first chips has a first bond pad deposed at an edge of a surface thereof and the first chips are stacked on the chip carrier in a step-like manner to expose the first bond pads;
• a plurality of first bonding wires for electrically connecting the first chip bond pads to the chip carrier;
• a second chip module having a plurality of second chips, wherein each of the second chips has a second bond pad deposed at an edge of a surface thereof and the second chips are stacked in the step-like manner on the first chip module to expose the second bond pads, a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive film, a portion of the first bonding wire between the bottom chip of the second chip module and the top chip of the first chip module is covered by the adhesive film, and the bottom chip is deviated from the top chip horizontally in a direction toward the first bonding wires connected to the first chip module;
• and
• a plurality of second bonding wires for electrically connecting the second bond pads of the second chip module to the chip carrier.

A multichip stacking structure, comprising

• a chip carrier;
• a first chip module having a plurality of first chips stacked on the chip carrier in a step-like manner;
• a plurality of first bonding wires for electrically connecting the first chip module to the chip carrier;
• a second chip module having at least one second chip and mounted on the first chip module, wherein a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive layer having fillers therein to support the bottom chip;
• and
• a plurality of second bonding wires for electrically connecting the second chip module to the chip carrier.

A multichip stacking structure, comprising

• a chip carrier;
• a first chip module having a plurality of first chips stacked on the chip carrier in a step-like manner;
• a plurality of first bonding wires for electrically connecting the first chip module to the chip carrier;
• a second chip module having at least one second chip and mounted on the first chip module by an adhesive film disposed between the second chip module and a top chip of the first chip module, wherein a portion of first bonding wires between the second chip module and the top chip of the first chip module is covered by the adhesive film;
• and
• a plurality of second bonding wires for electrically connecting the second chip module to the chip carrier.