Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package

A semiconductor chip structure comprising:

• a semiconductor chip;
• a first insulation layer on the semiconductor chip, the first insulation layer having a first hole exposing a pad of the semiconductor chip;
• a redistribution layer partially on the first insulation layer and in the first hole to be connected to the pad;
• a second insulation layer on the redistribution layer and the first insulation layer, the second insulation layer having at least one groove, which has an upper width and a lower width greater than the upper width, at an upper surface portion of the second insulation layer;
• and
• an adhesive layer on the second insulation layer, the adhesive layer having at least one protrusion, which has an upper width and a lower width less than the upper width, interlocked with the at least one groove.

A method of manufacturing a semiconductor chip structure, comprising:

• forming a first insulation layer on a semiconductor chip, the first insulation layer having a first hole that exposes a pad of the semiconductor chip;
• partially forming a redistribution layer on the first insulation layer and in the first hole to be connected to the pad;
• forming a second insulation layer on the redistribution layer and the first insulation layer, the second insulation layer having at least one groove, which has an upper width and a lower width greater than the upper width, formed at an upper surface portion of the second insulation layer;
• and
• forming an adhesive layer on the second insulation layer, the adhesive layer having at least one protrusion, which has an upper width and a lower width less than the upper width, interlocked with the at least one groove.