Chip having side pad, method of fabricating the same and package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorJiyong PARK
Life of this patent
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Abstract
A semiconductor device includes a first chip having a top surface, a bottom surface and a side surface connected to the top and bottom surfaces. The first chip includes a chip substrate; a lower conductive pattern over the chip substrate; an interlayer dielectric layer over the lower conductive pattern; and an upper conductive pattern over the interlayer dielectric layer. At least a portion of the lower conductive pattern and at least a portion of the upper conductive pattern are exposed on the side surface of the first chip to collectively form a side pad.
Claims49
A semiconductor device, comprising:
- a first chip having a top surface, a bottom surface and aside surface connected to the top and bottom surfaces, wherein the first chip comprises:
- a chip substrate;
- a lower conductive pattern over the chip substrate;
- an interlayer dielectric layer over the lower conductive pattern;
- and
- an upper conductive pattern over the interlayer dielectric layer,
- wherein at least a portion of the lower conductive pattern and at least a portion of the upper conductive pattern are exposed on the side surface of the first chip to collectively form a side pad.
A method of forming a semiconductor device, comprising:
- forming a first chip having a top surface, a bottom surface and a side surface connected to the top and bottom surfaces, wherein forming the first chip comprises:
- providing a chip substrate;
- forming a lower conductive pattern over the chip substrate;
- forming an interlayer dielectric layer over the lower conductive pattern;
- and
- forming a upper conductive pattern over the interlayer dielectric layer,
- wherein the lower and upper conductive patterns extend into the dicing area, and
- wherein at least a portion of the lower conductive pattern and at least a portion of the upper conductive pattern are exposed on the side surface of the first chip to collectively form a side pad.
Dependencies are inferred from the claim text.