Electronic device having metal pad structure and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorJae-Whoan Ga
Life of this patent
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Abstract
An electronic device may include a protective insulating layer formed over a substrate. A plurality of metal pad structures may be spaced apart from one another. Each of the plurality of metal pad structures may pass through the protective insulating layer and/or have a top surface disposed at a higher level than the protective insulating layer. Insulating barrier spacers may be on sidewalls of the metal pad structures. Each of the insulating barrier spacers may include a top surface disposed at a higher level than the metal pad structures.
Claims24
An electronic device, comprising:
- a substrate
- a protective insulating layer formed over the substrate;
- a plurality of metal pad structures spaced apart from one another, each of the plurality of metal pad structures passing through the protective insulating layer and including a top surface disposed at a higher level than the protective insulating layer;
- and
- insulating barrier spacers on sidewalls of the plurality of metal pad structures, each of the insulating barrier spacers including a top surface disposed at a higher level than the metal pad structures.
A method of fabricating an electronic device, comprising:
- forming a plurality of metal pad structures spaced apart from one another and passing through a protective insulating layer formed over a substrate, each of the plurality of metal pad structures including a top surface disposed at a higher level than the protective insulating layer;
- and
- forming insulating barrier spacers on sidewalls of the plurality of metal pad structures, each of the insulating barrier spacers including a top surface disposed at a higher level than the metal pad structures.
Dependencies are inferred from the claim text.