Semiconductor device package and manufacturing method thereof
OwnerJun Young YANG, You Ock JOO +1inventors
InventorsJun Young YANG, You Ock JOO, Dong Pil JUNG
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Abstract
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.
Claims10
A semiconductor device package comprising:
- a substrate;
- a semiconductor device mounted and electrically coupled to the substrate;
- a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate;
- and
- an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device,
- wherein the electromagnetic interference shielding layer is a layer of conductive paint in contact with the package body.
A semiconductor device package comprising:
- a substrate;
- a semiconductor device mounted and electrically coupled to the substrate;
- a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate;
- and
- an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device,
- wherein the electromagnetic interference shielding layer is an electroless plated metal layer in contact with the package body.
A semiconductor device package comprising:
- a substrate;
- a semiconductor device mounted and electrically coupled to the substrate;
- a package body encapsulating the semiconductor device against a portion of an Lpper surface of the substrate;
- and
- an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device,
- wherein the electromagnetic interference shielding layer is a metal cover securely attached to the package body via an adhesive layer.
A semiconductor device package comprising:
- a substrate;
- a semiconductor device mounted and electrically coupled to the substrate;
- a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate;
- an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device;
- and
- at least one ground trace extending on the upper surface of the substrate and the shielding layer is connected to the ground trace.
Dependencies are inferred from the claim text.