Semiconductor device manufacturing method, semiconductor device, and wiring board

A semiconductor device comprising:

• a plurality of metal posts each having a first surface and a second surface facing a side opposite to the first surface, the metal posts arranged in vertical and lateral directions in a plan view, the metal posts including a first metal post and a second metal post;
• an integrated circuit element fixed to the first surface of the first metal post;
• a conductive material, the conductive material coupling the first surface of the second metal post and a pad terminal of the integrated circuit element;
• and
• a resin sealing the metal posts, the integrated circuit element, and the conductive material, wherein
• the second surfaces of the metal posts are exposed from the resin.

A wiring board to be used to fix an integrated circuit element and draw a pad terminal of the integrated circuit element to outside, the wiring board comprising:

• a substrate;
• and
• a plurality of metal posts arranged in vertical and lateral directions in a plan view on the substrate, wherein
• the substrate and the metal posts are bonded together via a type of adhesive that loses adhesion force thereof if the adhesive is subjected to a predetermined process.