Heat sink with preattached thermal interface material and method of making same
AssigneeIntel Corporation
InventorsSabina J. Houle, Carl Deppisch
Life of this patent
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Abstract
A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.
Claims10
An article comprising:
- a heat spreader substrate;
- a thermal interface material over the heat spreader substrate;
- and
- a diffusion bonding zone between the heat spreader substrate and the thermal interface material, wherein the diffusion bonding zone includes at least a portion of the thermal interface material, and wherein the diffusion bonding zone is characteristic of a stamping process.
A package comprising:
- a die bonded to an article, the article including:
- a heat spreader substrate;
- a thermal interface material over the heat spreader substrate;
- and
- a diffusion bonding zone between the heat spreader substrate and the thermal interface material, wherein the diffusion bonding zone includes at least the thermal interface material, and wherein the diffusion bonding zone is characteristic of a stamping process.
A computer system comprising:
- a microelectronic die disposed upon a mounting substrate;
- an integrated heat spreader disposed over the microelectronic die, the integrated heat spreader, including:
- a heat spreader substrate;
- a thermal interface material over the heat spreader substrate;
- and
- a diffusion bonding zone between the heat spreader substrate and the thermal interface material, wherein the diffusion bonding zone includes at least a portion of the thermal interface material, and wherein the diffusion bonding zone is characteristic of a stamping process;
- and
- at least one of an input device and an output device.
Dependencies are inferred from the claim text.