Semiconductor device and method of manufacturing the same
AssigneeOki Electric Industry Co., Ltd.
InventorKenji Fuchinoue
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Abstract
a method of manufacturing a semiconductor device including (1) providing a metal plate having an upper surface and a back surface, the metal plate including a plurality of lids disposed in matrix, which are defined by a first groove formed from the upper surface, (2) providing a ceramic sheet having an upper surface and a back surface, the ceramic sheet including a plurality of headers disposed in matrix, which are defined by a second groove formed from the back surface, (3) fixing the metal plate on the ceramic sheet by facing the back surface of the onto metal plate to the upper surface of the ceramic sheet, wherein the first groove is aligned with the second groove, and (4) dividing the metal plate and the ceramic sheet along the first and the second grooves.
Claims16
A method of manufacturing a semiconductor device, comprising:
- providing a metal plate having an upper surface and a back surface, the metal plate including a plurality of lids disposed in matrix, which are defined by a first groove formed from the upper surface;
- providing a ceramic sheet having an upper surface and a back surface, the ceramic sheet including a plurality of headers disposed in matrix, which are defined by a second groove formed from the back surface;
- fixing the metal plate on the ceramic sheet by facing the back surface of the onto metal plate to the upper surface of the ceramic sheet, wherein the first groove is aligned with the second groove;
- and
- dividing the metal plate and the ceramic sheet along the first and the second grooves.
A semiconductor device, including:
- a header, which has a side surface, including a cavity whose opening are located on its upper surface, wherein the side surface of the header includes a first area and a second area;
- a semiconductor chip being placed in the cavity;
- and
- a lid, which has a side surface, sealing the cavity, wherein the side surface of the lid includes a first area, which is located closer to the header, and a second area, which is located farer to the header,
- wherein a first breaking face is formed in the first area of the lid, and a first face, which is different from the first breaking face, is formed in the second area of the lid, and
- wherein the first area of the header is located closer to the lid and a second area of the header is located farer to the lid, and wherein a first breaking face is formed in the first area of the header, and a second face, which is different from the second breaking face, is formed in the second area of the header.
Dependencies are inferred from the claim text.