Electronic device and method for manufacturing electronic device
AssigneeFujitsu Limited
InventorsYoshihiro Kubota, Shirou Youda, Kazuto Tsuji
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Abstract
An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.
Claims9
An electronic device including a substrate having first and second peripheral portions, the first peripheral portion providing a shearing position for separation, the electronic device comprising:
- a plurality of wiring layers which forms a functional surface wiring on the substrate,
- an electronic element mounted over the substrate, and
- an encapsulation member formed over the substrate and the electronic element, the surface wiring being selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.
An electronic device manufacturing method including a substrate divided from a base substrate having a plurality of wiring layers and an encapsulation member formed over one surface of the substrate and an electronic element, the method comprising:
- forming a pore for dividing the base substrate into each of the substrates, the pore being formed around the substrate, the encapsulation member being formed thereon, remaining a connecting portion connecting each of the substrates in the base substrate;
- forming functional surface wires in one of the wiring layers adjacent to the encapsulation member;
- forming the encapsulation member over the substrate surface and the electronic element;
- and
- separating the base substrate into each of the substrates by shearing the connecting portions.
Dependencies are inferred from the claim text.