Apparatus and method for reduced delamination of an integrated circuit module
AssigneeTriQuint Semiconductor, Inc.
InventorsDean L. Monthei, Antonio Espinoza, Waldemar J. Holgado
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Abstract
An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
Claims27
An integrated circuit, comprising:
- a laminate substrate;
- one or more die attach pads;
- one or more metal oxide regions disposed on the one or more die attach pads;
- and
- one or more non-oxidized metal regions disposed on the one or more die attach pads.
An integrated circuit module, comprising:
- a laminate substrate;
- one or more integrated circuit die operably coupled with the laminate substrate;
- and
- a plastic semiconductor package overmolded with the laminate substrate.
A method for providing reduced delamination of an integrated circuit, the method comprising:
- masking one or more die attach pads of an integrated circuit to block the plating in one or more metal oxide regions;
- plating the non-masked regions of the one or more die attach pads with conductive metal;
- stripping the mask from the one or more die attach pads;
- etching the one or more metal oxide regions with an oxidized finish;
- and
- cleaning the integrated circuit.
A method for providing reduced delamination of an integrated circuit, the method comprising:
- plating one or more die attach pads of an integrated circuit with conductive material;
- masking the one or more plated die attach pads to block the conductive material in one or more metal oxide regions;
- etching the one or more metal oxide regions with an oxidized finish;
- stripping the mask from the one or more die attach pads;
- and
- cleaning the integrated circuit.
Dependencies are inferred from the claim text.