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US 2008/0174001 A1Published application
Semiconductor device
AssigneeFujitsu Limited
InventorsYoshitaka Aiba, Tetsuya Fujisawa, Yoshiyuki Yoneda
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Abstract
A semiconductor device is disclosed that includes a support substrate, a first semiconductor element that is mounted on one side of the support substrate, a second semiconductor element including a high frequency electrode that is mounted on the one side of the support substrate, a via hole that is provided at the support substrate in relation to the high frequency electrode, and an external connection electrode that is provided on the other side of the support substrate in relation to the via hole.
Claims6
A semiconductor device comprising:
- a support substrate;
- a first semiconductor element that is mounted on one side of the support substrate;
- a second semiconductor element including a high frequency electrode that is mounted on said one side of the support substrate;
- a via hole that is provided at the support substrate in relation to the high frequency electrode;
- and
- an external connection electrode that is provided on the other side of the support substrate in relation to the via hole;
- wherein a center axis of the high frequency electrode is positioned within a periphery of the via hole.
4 more elements
Dependencies are inferred from the claim text.