Back to results
US 2008/0174000 A1Published application
Zigzag-stacked package structure
AssigneeChipMOS Technologies Inc.
InventorsYu-Ren CHEN, Yeong-Jyh Lin
Life of this patent
Estimating the term…
Abstract
A die-stacked package structure, wherein a plurality of dies are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each die on the substrate can all be exposed; a plurality of metal wires are provided for electrically connecting the plurality of metal pads on the plurality of dies with the plurality metallic ends on the substrate in one wire bonding process; then an encapsulate is provided for covering the plurality of stacked dies, a plurality of metal wires and the plurality of metallic ends on the substrate.
Claims21
A zigzag-stacked package structure comprising:
- a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads;
- a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected;
- an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material;
- Wherein one side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.
1 more element
A zigzag-stacked package structure comprising:
- a lead frame including a plurality of inner leads, a plurality of outer leads, at least one bus bar and a die paddle, and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads, the bus bar is disposed between the inner leads and the die paddle;
- a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the inner leads are electrically connected;
- an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material;
- Wherein one side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon and the other side of an active surface on each of the first dies and the second dies structure respectively includes a plurality of pads disposed thereon.
1 more element
A zigzag-stacked package structure, comprising:
- a package substrate including a plurality of metal ends disposed thereon;
- and
- a zigzag-stacked structure is fixedly connected on a circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, a plurality of exposed pads on the second dies and the metal ends on the circuit substrate are electrically connected.
A zigzag-stacked package structure comprising:
- a package substrate including a plurality of metal ends disposed thereon;
- and
- a zigzag-stacked structure is fixedly connected on a circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the metal ends on the circuit substrate are electrically connected;
- Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
1 more element
A zigzag-stacked package structure comprising:
- a circuit substrate including a plurality of metal ends disposed on a top surface and the metal ends is connected with a connective line disposed on the reverse surface to connect and a plurality of metal balls;
- and
- a zigzag-stacked structure connected on the top surface of the circuit substrate and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, the second dies and the metal ends on the circuit substrate are electrically connected;
- Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
1 more element
A zigzag-stacked package structure comprising:
- a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads;
- a zigzag-stacked structure connected on the die paddle and the zigzag-stacked structure includes a plurality of first dies and a plurality of second dies, which are alternatively and respectively stacked to each other, and the first dies, a plurality of exposed pads on the second dies and the inner leads are electrically connected;
- and
- an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
1 more element
A zigzag-stacked package structure comprising:
- a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads;
- a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes two first dies and two second dies, which are alternatively and respectively stacked to each other, and the two first dies and the two second dies are stacked to each other with a shift distance in order to expose a plurality of pads on each of the dies;
- a plurality of metal wires used to electrically connect the exposed pads on the two first dies and the two second dies and the inner leads;
- and
- an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
2 more elements
A zigzag-stacked package structure comprising:
- a lead frame including a plurality of inner leads, a plurality of outer leads and a die paddle and wherein the die paddle is disposed between the inner leads and a height difference formed between the die paddle and the inner leads;
- a zigzag-stacked structure is fixedly connected on the die paddle and the zigzag-stacked structure includes three first dies and a three second dies, which are alternatively and respectively stacked to each other, and the three first dies and the three second dies are stacked to each other with a shift distance in order to expose a plurality of pads on each of the dies;
- a plurality of metal wires used to electrically connect the exposed pads on the three first dies and the three second dies and the inner leads;
- and
- an encapsulated material covering the zigzag-stacked structure and the lead frame, and the outer leads are extended over the encapsulated material.
2 more elements
A zigzag-stacked package structure comprising:
- a package substrate including a plurality of metal ends disposed thereon and
- a zigzag-stacked structure is fixedly connected on the circuit substrate and the zigzag-stacked structure includes two first dies and two second dies, which are alternatively and respectively stacked to each other, and the two first dies, the two second dies and the metal ends on the circuit substrate are electrically connected;
- Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
A zigzag-stacked package structure comprising:
- a circuit substrate including a plurality of metal ends disposed thereon and
- a zigzag-stacked structure connected on the circuit substrate and the zigzag-stacked structure includes three first dies and three second dies, which are alternatively and respectively stacked to each other, and the three first dies, the three second dies and the metal ends on the package substrate are electrically connected;
- Wherein one side of an active surface on each of the first dies of the zigzag-stacked structure includes a plurality of pads disposed and exposed thereon and the other side of the active surface on each of the second dies includes a plurality of pads disposed and exposed thereon.
Dependencies are inferred from the claim text.